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Winbond - About the company

Winbond is a public company based in Taichung (Taiwan), founded in 1987. It operates as a Provider of volatile memory integrated circuits. The company has 28 active competitors, including 5 funded and 12 that have exited. Its top competitors include companies like RAAAM, Verticalcompute and AP Memory.

Company Details

Provider of volatile memory integrated circuits. Its major products include speciality and mobile dynamic random access memory(DRAM), and code storage flash memory. Its product portfolio includes microcontroller ICs and consumer electronics ICs. It caters to automotive, industrial, communication, computer, and consumer sectors.
Registered Address
San Jose,California
Key Metrics
Founded Year
1987
Location
Taichung, Taiwan
Stage
Public
Ranked
Employee Count
1,544 as on Jun 30, 2026
Investment & Acquisitions
Similar Companies
Exit Details
Public

Winbond's IPO details

Winbond got listed on Oct 18, 1995.
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Winbond's funding and investors

Winbond is a funded company. Winbond has 2 institutional investors.

Winbond's founders and board of directors

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Winbond's employee count trend

Winbond has 1,544 employees as of Jun 26. Here is Winbond's employee count trend over the years:
Employee count trend for Winbond
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Winbond's Competitors and alternates

Top competitors of Winbond include RAAAM, Verticalcompute and AP Memory. Here is the list of Top 10 competitors of Winbond, ranked by Tracxn score:
Rank
Company Details
Short Description
Total Funding
Investors
Tracxn Score
1st
Logo for RAAAM
RAAAM
2020, Petah Tikva (Israel), Series A
Developer of on-chip memory technology designed as a SRAM replacement
$24.5M
56/100
2nd
Logo for Verticalcompute
Verticalcompute
2005, Leuven (Belgium), Seed
Developer of chiplet technology for data-intensive workloads and AI acceleration
$63.5M
54/100
3rd
Logo for AP Memory
AP Memory
2011, Zhubei (Taiwan), Public
Developer of memory product for applications in IoT
-
-
47/100
4th
Logo for Montage Technology
Montage Technology
2004, Shanghai (China), Public
Provider of analog and mixed-signal fabless semiconductor
-
47/100
5th
Logo for GSI Technology
GSI Technology
1995, Cupertino (United States), Public
Manufacturer of high-performance memory product
-
-
46/100
6th
Logo for Winbond
Winbond
1987, Taichung (Taiwan), Public
Provider of volatile memory integrated circuits
-
46/100
7th
Logo for Virtium
Virtium
1997, Rancho Santa Margarita (United States), Acquired
Industrial embedded memory and storage
-
45/100
8th
Manufacturer of standard DRAM, low power DRAM, and memory modules
-
-
43/100
9th
Logo for Goldkey
Goldkey
1998, Chung ho (Taiwan), Public
Manufacturer of the DRAM IC chips
-
41/100
10th
Logo for Xenergic
Xenergic
2017, Lund (Sweden), Series A
Developer of on-chip memory IP solutions for system-on-chip circuit designs
$6.51M
40/100
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Winbond's Investments and acquisitions

Winbond has made 2 investments in IQM and Kneron. Winbond has not made any acquisitions as of now.

News related to Winbond

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Media has covered Winbond for a total of 13 events in the last 1 year, 6 of them have been about company updates.
Quantum-Based IQM Secures $300M for Global ExpansionElectronicsforyouSep 04, 2025IQM, Ten Eleven Ventures, Tesi, Elo and 6 others
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